Innovative LED display technology is no longer a new idea in the industry with more and more Micro/Mini LED display products exhibited at major international events in the past two years.

Due to its excellent electrical and thermal conductivity, Ag sintering is emerging as a proven and reliable bonding technology for high-power-density applications.

The photovoltaic (PV) industry is growing at an increasingly rapid rate. With constant changes in terms of technology, price, efficiency, and capacities, it can be challenging to figure out what the next year (and decade) will bring.  Technology trends on wafers, cells and module need to be answered.

The global CCM market has been ballooning thanks to expeditious penetration of multi-camera phones and advances in automotive ADAS, being worth $27.1 billion in 2018 and projected to be $45.7 billion in 2024, growing at a compound annual rate of 9.1% in between.

In the manufacturing process of camera modules, the most commonly used method to pack sensor chips or imager is COB (Chip on Board). It means the sensor chips are directly bonded to PCB (printed circuit board) or FPC (flexible printed circuit) using a thermally cured die attach adhesive (DA).