Semiconductor packaging refers to the process of processing a wafer that passes the test to obtain an independent chip according to the product model and functional requirements. The packaging process is: the wafer from the wafer front process is cut into small wafers (Die) after the dicing process, and then the cut wafer is glued to the corresponding substrate (lead frame) islands. Then, use ultra-fine metal (gold-tin-copper-aluminum) wires or conductive resin to connect the bond pads of the wafer to the corresponding leads of the substrate and form the required circuit; then The individual chips are packaged and protected by a plastic case. After plastic packaging, a series of operations are performed. After the packaging is completed, the finished product is tested. Usually, it passes through the procedures of Incoming, Test, and Packing.