INNOVATION
Smart Card
- Categories:Application Areas
- Time of issue:2021-03-10 21:02:03
- Views:0
Description:Manufacturing efficiency and material cost are of major focuses in smart card assembly industry. By leveraging its experience on epoxy and acrylate adhesives used in semiconductor packaging industry, Yongoo has successfully developed die attach adhesives and UV encapsulants for smart card assembly. These products provide better workability and reliability than competitions.
Information
Manufacturing efficiency and material cost are of major focuses in smart card assembly industry. By leveraging its experience on epoxy and acrylate adhesives used in semiconductor packaging industry, Yongoo has successfully developed die attach adhesives and UV encapsulants for smart card assembly. These products provide better workability and reliability than competitions.
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