INNOVATION
Semiconductor Packaging
- Categories:Application Areas
- Time of issue:2021-03-10 13:33:24
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Description:Driven by die size shrinkage, cost reduction and performance improvement, semiconductor packaging companies are paying more and more attention to the work life, dispensibility, material cost and conductivity of die attach adhesives. Over the past 14 years, Yongoo has been devoted to the development of epoxy and acrylate die attach adhesives. Our products meet and exceed customers expectations.
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Driven by die size shrinkage, cost reduction and performance improvement, semiconductor packaging companies are paying more and more attention to the work life, dispensibility, material cost and conductivity of die attach adhesives. Over the past 14 years, Yongoo has been devoted to the development of epoxy and acrylate die attach adhesives. Our products meet and exceed customers expectations.
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